Pemasangan Plate for Wafer Lapping Penipisan

Pemasangan plat for wafer lapping thinning is used to accurately control the wafer ketebalan in lapping process; The carrier plate is composed of a carrier plate and some diamond points;

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Pemasangan plat for wafer lapping thinning is used to accurately control the wafer thickness in lapping process; The carrier plate is composed of a carrier plate and some diamond points; Wafers are fixed on the carrier plate by sticking wax, and the diamond point is used to control the ketebalan of the wafer after lapping; Before lapping, set the height of the diamond point as required, which is the target ketebalan of the wafer after lapping. When the wafers reach the set target ketebalan, the support of diamond will prevent further lapping of the wafer, so as to control the wafer ketebalan.